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HGP component with effusion cooling element having coolant swirling chamber

Patent ·
OSTI ID:1892663

An effusion cooling element for the surface of a hot gas path (HGP) component is disclosed. The effusion cooling element includes a coolant swirling chamber embedded within the body of the HGP component. A coolant delivery passage is in the body and configured to deliver a coolant to the coolant swirling chamber. The coolant swirling chamber imparts a centrifugal force to the coolant. An effusion opening is in the HGP surface and in fluid communication with the coolant swirling chamber, the effusion opening having a smaller width than the coolant swirling chamber. The coolant exits the effusion opening over substantially all of 360° about the effusion opening, creating a coolant film on the HGP surface.

Research Organization:
General Electric Co., Schenectady, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FE0023965
Assignee:
General Electric Company (Schenectady, NY)
Patent Number(s):
11,262,074
Application Number:
16/360,177
OSTI ID:
1892663
Country of Publication:
United States
Language:
English

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