Experiments and modelling of adhesive failure initiation of an epoxy underfill: a study of electronic packaging survivability
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Univ. of New Mexico, Albuquerque, NM (United States)
Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- NA0003525
- OSTI ID:
- 1883176
- Report Number(s):
- SAND2021-1429J; 697277
- Journal Information:
- International Journal of Theoretical and Applied Multiscale Mechanics, Journal Name: International Journal of Theoretical and Applied Multiscale Mechanics Journal Issue: 1 Vol. 4; ISSN 1755-9995
- Publisher:
- Inderscience PublishersCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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