Ultralow Thermal Conductivity in Organoclay Nanolaminates Synthesized via Simple Self-Assembly

Losego, Mark D.; Blitz, Ian P.; Vaia, Richard A.; Cahill, David G.; Braun, Paul V.

doi:10.1021/nl4007326

Ultralow Thermal Conductivity in Organoclay Nanolaminates Synthesized via Simple Self-Assembly

Journal Article · Wed Apr 17 00:00:00 EDT 2013 · Nano Letters

DOI:https://doi.org/10.1021/nl4007326· OSTI ID:1876406

Losego, Mark D. ^[1]; Blitz, Ian P. ^[2]; Vaia, Richard A. ^[3]; Cahill, David G. ^[2]; Braun, Paul V. ^[2]

Univ. of Illinois, Urbana, IL (United States); University of Illinois
Univ. of Illinois, Urbana, IL (United States)
Air Force Research Lab., Wright-Patterson AFB, OH (United States)

Because interfaces impede phonon transport of thermal energy, nanostructuring can transform fully dense solids into ultralow thermal conductivity materials. Here we report a simple self-assembly approach to synthesizing organoclay nanolaminates with cross-planar thermal conductivities below 0.10 W m^–1 K^–1—a 5-fold decrease compared to unmodified clay. These organoclays are produced via alkylammonium cation exchange with colloidally dispersed montmorillonite clay sheets followed by solvent casting. Time-domain thermoreflectance (TDTR) is used to evaluate the thermal conductivity of the organoclay nanolaminates. Variations in both organic layer thickness and cation chemistry are investigated. At these interface densities (1.0–1.5 interfaces/nm), we demonstrate that thermal conductivity is relatively independent of nanolaminate spacing. A simple series resistance model describes the behavior and gives an interfacial thermal conductance value of ≈150 MW m^–2 K^–1 for the organic/clay interface, consistent with similar organic–inorganic interfaces. Furthermore, the wide range of compositional substitutions and structural variations possible in these materials, make organoclays a versatile new platform for investigating the underlying physics of nanolaminate structures.

View Accepted Manuscript (DOE)

Research Organization:: Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division

Grant/Contract Number:: FG02-07ER46453; FG02-07ER46471

OSTI ID:: 1876406

Journal Information:: Nano Letters, Journal Name: Nano Letters Journal Issue: 5 Vol. 13; ISSN 1530-6984

Publisher:: American Chemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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77 NANOSCIENCE AND NANOTECHNOLOGY
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interfaces
interfacial thermal conductance
layers
nanolaminate
organoclay
self-assembly
thermal conductivity

Ultralow Thermal Conductivity in Organoclay Nanolaminates Synthesized via Simple Self-Assembly

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