Integration and Packaging
Conference
·
OSTI ID:1873679
- UC, Santa Cruz, Inst. Part. Phys.
- Fermilab
- Unlisted
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.
- Research Organization:
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 1873679
- Report Number(s):
- FERMILAB-CONF-22-337-PPD; arXiv:2203.06093; oai:inspirehep.net:2050076
- Country of Publication:
- United States
- Language:
- English
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