Room temperature stress relaxation in nanocrystalline Ni measured by micropillar compression and miniature tension
Journal Article
·
· Journal of Materials Research
- Swiss Federal Laboratories for Materials Science and Technology (Empa), Dübendorf (Switzerland)
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
In this report, we report a micropillar stress relaxation technique employing a stable displacement-controlled, in-situ scanning electron microscope indenter, and unusually large micropillars to precisely measure stress relaxation in electroplated nanocrystalline Ni thin films. The observed stress relaxation is significant under constant displacement: even well below the 0.2% offset yield strength, the stresses relax by ~4% within a minute; in the work hardening regime, stress relaxes by ~9% in 1 min. A logarithmic fit of the relaxation curves is consistent with an Arrhenius thermal activation of plasticity and suggests an activation volume in the vicinity of ~10 b3. The apparent and effective activation volumes diverge at lower strains, particularly in the “elastic” regime. These measurements are compared to similar measurements performed on free-standing thin film tensile coupons. Both methods yield similar results, thereby validating the applicability of pillar compression to capture time-dependent plasticity. To our knowledge, these are the first micropillar stress relaxation experiments on metals ever reported.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- NA0003525
- OSTI ID:
- 1870473
- Report Number(s):
- SAND2022-3828J; 704786
- Journal Information:
- Journal of Materials Research, Journal Name: Journal of Materials Research Journal Issue: 8 Vol. 31; ISSN 0884-2914
- Publisher:
- Materials Research SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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