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Correlating Incident Heat Flux and Source Temperature to Meet ASTME1529 Requirements for Ram Packaging Components Thermal Testing.

Conference ·
DOI:https://doi.org/10.2172/1869763· OSTI ID:1869763

Abstract not provided.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
NA0003525
OSTI ID:
1869763
Report Number(s):
SAND2021-6110C; 696350
Country of Publication:
United States
Language:
English