Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics

Moreno, Gilberto; Narumanchi, Sreekant; Tomerlin, Jeff; Major, Joshua

doi:10.1109/tpel.2022.3171744

Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics

Journal Article · Tue May 03 00:00:00 EDT 2022 · IEEE Transactions on Power Electronics

DOI:https://doi.org/10.1109/tpel.2022.3171744· OSTI ID:1869695

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National Renewable Energy Lab. (NREL), Golden, CO (United States)

This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm³/s [1 L/min] to 68.3 cm³/s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm³ total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm²K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.

View Accepted Manuscript (DOE)

Research Organization:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1869695

Report Number(s):: NREL/JA-5400-81572; MainId:82345; UUID:df53af63-2932-4e9d-a549-feafc57291a8; MainAdminID:64555

Journal Information:: IEEE Transactions on Power Electronics, Journal Name: IEEE Transactions on Power Electronics Journal Issue: 10 Vol. 37; ISSN 0885-8993

Publisher:: IEEECopyright Statement

Country of Publication:: United States

Language:: English

References (19)

Heat spreading performance of SiC-based power module with bonded vapour chamber for electric powertrain integration Li, Bo; Chen, Yiyi; Wang, Xuehui Applied Thermal Engineering, Vol. 181 https://doi.org/10.1016/j.applthermaleng.2020.115896	journal	November 2020
Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module Chen, Yiyi; Li, Bo; Wang, Xin Thermal Science and Engineering Progress, Vol. 10 https://doi.org/10.1016/j.tsep.2019.01.007	journal	May 2019
Thermal conductivity of 4H-SiC single crystals Wei, Rusheng; Song, Sheng; Yang, Kun Journal of Applied Physics, Vol. 113, Issue 5 https://doi.org/10.1063/1.4790134	journal	February 2013
Automotive Power Module Packaging: Current Status and Future Trends Yang, Yuhang; Dorn-Gomba, Lea; Rodriguez, Romina IEEE Access, Vol. 8 https://doi.org/10.1109/ACCESS.2020.3019775	journal	January 2020
Evaluation of performance and opportunities for improvements in automotive power electronics systems Moreno, Gilberto; Bennion, Kevin; King, Charles 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) https://doi.org/10.1109/ITHERM.2016.7517548	conference	May 2016
Concepts for embedded cooling of vertical current wide band-gap semiconductor devices Dede, Ercan M.; Zhou, Feng; Joshi, Shailesh N. 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) https://doi.org/10.1109/ITHERM.2017.7992529	conference	May 2017
High voltage stacked diode package with integrated thermal management Boteler, Lauren M.; Hinojosa, Miguel; Niemann, Valerie A. 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) https://doi.org/10.1109/ITHERM.2017.7992583	conference	May 2017
A review of SiC power module packaging technologies: Attaches, interconnections, and advanced heat transfer Passmore, Brandon S.; Lostetter, Alexander B. 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) https://doi.org/10.1109/IWIPP.2017.7936763	conference	April 2017
Stacked power module with integrated thermal management Boteler, Lauren M.; Niemann, Valerie A.; Urciuoli, Damian P. 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) https://doi.org/10.1109/IWIPP.2017.7936764	conference	April 2017
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues Lee, Haksun; Smet, Vanessa; Tummala, Rao IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 8, Issue 1 https://doi.org/10.1109/JESTPE.2019.2951801	journal	March 2020
A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages Iradukunda, Ange-Christian; Huitink, David R.; Luo, Fang IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 8, Issue 1 https://doi.org/10.1109/JESTPE.2019.2953102	journal	March 2020
Optimal Design of Integrated Heat Pipe Air-Cooled System Using TLBO Algorithm for SiC MOSFET Converters Alizadeh, Maryam; Rodriguez, Romina; Bauman, Jennifer IEEE Open Journal of Power Electronics, Vol. 1 https://doi.org/10.1109/OJPEL.2020.2985700	journal	January 2020
Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material Bai, J. G.; Zhang, Z. Z.; Calata, J. N. IEEE Transactions on Components and Packaging Technologies, Vol. 29, Issue 3 https://doi.org/10.1109/TCAPT.2005.853167	journal	September 2006
Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging Ivanova, Mariya; Avenas, Yvan; Schaeffer, Christian IEEE Transactions on Power Electronics, Vol. 21, Issue 6 https://doi.org/10.1109/TPEL.2006.882974	journal	January 2006
Drift Region Integrated Microchannels for Direct Cooling of Power Electronic Devices: Advantages and Limitations Vladimirova, Kremena; Crebier, Jean-Christophe; Avenas, Yvan IEEE Transactions on Power Electronics, Vol. 28, Issue 5 https://doi.org/10.1109/TPEL.2012.2213267	journal	May 2013
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes Broughton, Justin; Smet, Vanessa; Tummala, Rao R. Journal of Electronic Packaging, Vol. 140, Issue 4 https://doi.org/10.1115/1.4040828	journal	August 2018
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions Moreno, Gilberto; Narumanchi, Sreekant; Feng, Xuhui Journal of Electronic Packaging, Vol. 144, Issue 1 https://doi.org/10.1115/1.4049815	journal	August 2021
Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management Bennion, Kevin; Moreno, Gilberto ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays https://doi.org/10.1115/IPACK2015-48382	conference	November 2015
New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids Griesinger, Andreas; Windel, Christian; Kwak, Yungwan Journal of Electronics Cooling and Thermal Control, Vol. 10, Issue 01 https://doi.org/10.4236/jectc.2021.101001	journal	January 2021

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