Technique for constructing high gradient insulators

Watson, Scott Avery; Winch, Nicola Maree; Sorensen, Eric Byron; Bronisz, Lawrence Eugene; Platts, David; Krogh, Michael L.; Noroña, Marcelo; Duran, Phillip A.

Title: Technique for constructing high gradient insulators

Patent · Tue Dec 21 00:00:00 EST 2021

OSTI ID:1860186

Watson, Scott Avery; Winch, Nicola Maree; Sorensen, Eric Byron; Bronisz, Lawrence Eugene; Platts, David; Krogh, Michael L.; Noroña, Marcelo; Duran, Phillip A.

A process for constructing a high-tensile strength, high-gradient insulator (HGI) may include stacking alternating layers of conductors and insulators, and vacuum pressure potting the stacked layers onto an insulating rod. The process may also include post machining the stacked layers to form a complete assembly of the HGI.

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Research Organization:: Triad National Security, LLC, Los Alamos, NM (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: 89233218CNA000001

Assignee:: Triad National Security, LLC (Los Alamos, NM)

Patent Number(s):: 11,205,530

Application Number:: 16/217,021

OSTI ID:: 1860186

Resource Relation:: Patent File Date: 12/11/2018

Country of Publication:: United States

Language:: English

References (8)

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Apparatus for laminating multilayered printed circuit boards Frohlich, Sigurd; Morris, James https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4596624 US Patent Document 4,596,624	patent	June 1986
Formation method of metal layer on resin layer, printed wiring board, and production method thereof Takai, Kenji; Moriike, Norio; Kamiyama, Kenichi https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7615277 US Patent Document 7,615,277	patent	November 2009
Multilayer circuit board fabricated from silicon Burgess, James F.; Glascock, II, Homer H.; Webster, Harold F. https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4803450 US Patent Document 4,803,450	patent	February 1989
Method for manufacturing multilayer circuit board and resin base material Wakizaka, Yasuhiro; Ikeda, Koichi; Kanda, Naoki https://doi.org/https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7614145 US Patent Document 7,614,145	patent	November 2009

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