Direct current microplasma formation around microstructure arrays
- Tsinghua University, Beijing (China). Department of Electrical Engineering; Tsinghua Univ., Beijing (China)
- EMD Performance Materials, Tempe, AZ (United States)
- Michigan State University, East Lansing, MI (United States). Fraunhofer Center for Coatings and Diamond Technologies
- Michigan State University, East Lansing, MI (United States). Department of Electrical and Computer Engineering
- Michigan State University, East Lansing, MI (United States). Fraunhofer Center for Coatings and Diamond Technologies; Michigan State University, East Lansing, MI (United States). Department of Electrical and Computer Engineering; Michigan State University, East Lansing, MI (United States). Department of Chemical Engineering and Materials Science
- Tsinghua University, Beijing (China). Department of Electrical Engineering
- Michigan State University, East Lansing, MI (United States). Department of Electrical and Computer Engineering; Michigan State University, East Lansing, MI (United States). Department of Computational Mathematics, Science and Engineering
We demonstrate the formation and transition behaviors of a microplasma around microstructure arrays at different gas pressures via two-dimensional particle-in-cell/Monte Carlo collision simulations. It is found that the microdischarge occurs outside the cathode microcavities at the lowest pressure and starts penetrating the microcavities with a curved sheath edge as the pressure increases. At higher pressure, coupled periodic microhollow cathode discharges (MHCDs) are formed inside the microcavities. Further increasing the gas pressure results in the disappearance of the MHCDs, and the dominant discharge shifts outside of the microcavity, locating above the protrusion tips. The effect of the space charge shielding on the discharge and the conditions for MHCD formation are discussed. The macroscopic discharge parameter scalings with the gas pressure and the electron kinetics are also examined. The results are helpful for deeply understanding the microplasma formation with nonplanar electrodes, which inform the scaling, design, and optimization of microplasma array devices across a wide range of pressure regimes in practical applications.
- Research Organization:
- Univ. of Michigan, Ann Arbor, MI (United States)
- Sponsoring Organization:
- National Natural Science Foundation of China (NSFC); National Science Foundation (NSF); US Air Force Office of Scientific Research (AFOSR); USDOE; USDOE Office of Science (SC), Fusion Energy Sciences (FES)
- Grant/Contract Number:
- SC0001939
- OSTI ID:
- 1850774
- Alternate ID(s):
- OSTI ID: 1780509
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 17 Vol. 118; ISSN 0003-6951
- Publisher:
- American Institute of Physics (AIP)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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OSTI ID:1850773