ECP Milestone Report: Identify initial kernels, bake-off problems (benchmarks) and miniapps (CEED-MS6)

Technical Report · Thu Jul 06 04:00:00 EDT 2017

DOI:https://doi.org/10.2172/1845630· OSTI ID:1845630

Dobrev, Veselin ^[1]; Dongarra, Jack ^[1]; Brown, Jed ^[1]; Fischer, Paul ^[1]; Haidar, Azzam ^[1]; Karlin, Ian ^[1]; Kolev, Tzanio ^[1]; Min, Misun ^[1]; Moon, Tim ^[1]; Ratnayaka, Thilina ^[1]; Tomov, Stanimire ^[1]; Tomov, Vladimir ^[1]

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1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

The CEED co-design center is developing a number of kernels, bake-off / benchmark problems (BPs) and mini-applications (miniapps) that capture the unique requirements of high-order finite element algorithms and use them to influence standards, best practices and vendors to generate more portable, better performing code across diverse hardware designs. This is a main activity in CEED’s Hardware, Applications and Finite Element thrusts. CEED’s miniapps, a.k.a. CEEDlings, are small, standalone applications - surrogates for sub-components of interest from the selected first wave of applications (the MARBL/LLNLApp and ExaSMR projects). The BPs are even smaller standalone programs that solve a simple physical problem, including discretization, linear and/or nonlinear solve, and potentially a relatively small number of time steps. A BP may be a proxy/surrogate for part of a miniapp or another problem of general interest. In CEED, both miniapps and BPs will be used extensively in the project to evaluate and compare the performance of algorithms in specific contexts. The parts of the miniapps and BPs that play an important role in their overall performance will be identified and separated as standalone kernels. These kernels and their interaction inside BPs, miniapps and the actual applications, will be the main focus of our optimization efforts. All three standalone pieces of software (miniapps, BPs, and kernels) will serve as a basis for engaging and collaborating with hardware vendors and software technologies (ST) projects. These partners can start at the bottom of the hierarchy, e.g. with the kernels, and easily transition to BPs and miniapps as all three families will be produced in the same CEED environment. In this milestone we identified the initial kernels, bake-off problems and miniapps and delivered software and documentation for them through the new CEED website, http://ceed.exascaleproject.org. We specifically identified the Nekbone miniapp for the ExaSMR application and developed a new miniapp, Laghos, for the MARBL/LLNLApp application. We also formulated four initial benchmark problems (BP1- BP4) with clearly defined performance metrics and performed an initial bake-off comparison between the Nek5000 (spectral element) and MFEM (high-order finite element) technologies. As part of the milestone, we also engaged vendors (AMD) and ST projects (MPICH, STRUMPACK). In this document we are reporting some details and results from these R&D activities, as well as additional project-wide activities performed in Q3 of FY17, including: making CEED software available on GitHub, developing the project website, and the preparation of CEED’s first annual meeting.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Advanced Scientific Computing Research (ASCR)
• DOE Contract Number: AC52-07NA27344
• OSTI ID: 1845630
• Report Number(s): LLNL-TR-734169; 886086
• Country of Publication: United States
• Language: English

Related Subjects

97 MATHEMATICS AND COMPUTING