2D Mg-Cu Intermetallic Compounds with Nontrivial Band Topology and Dirac Nodal Lines

Wu, Rongting; Wu, Ze‐Bin; Božović, Ivan

doi:10.1002/aelm.202100927

2D Mg-Cu Intermetallic Compounds with Nontrivial Band Topology and Dirac Nodal Lines

Journal Article · Thu Dec 23 00:00:00 EST 2021 · Advanced Electronic Materials

DOI:https://doi.org/10.1002/aelm.202100927· OSTI ID:1838159

Wu, Rongting ^[1]; Wu, Ze‐Bin ^[2]; ^[3]

Yale Univ., New Haven, CT (United States)
Brookhaven National Lab. (BNL), Upton, NY (United States)
Brookhaven National Lab. (BNL), Upton, NY (United States); Yale Univ., New Haven, CT (United States)

Synthesis of vertical heterostructures that include atomically thin layers of materials with topologically nontrivial energy bands is desirable for exploring exotic quantum states. In this study, the authors report on atomic-layer-by-layer deposition of magnesium on copper(111) surface by molecular beam epitaxy, monitored in situ by low-energy electron microscopy and diffraction, and modeled by ab initio theory. It is found that a 2D MgCu₂ intermetallic compound forms during initial Mg deposition and persists till a full monolayer of Mg is formed. Deposition of additional Mg triggers a phase transition from the commensurate MgCu₂ to an incommensurate Mg₂Cu layer and enables growth of the second layer of Mg. Ab initio calculations indicate non-trivial topology of the electron bands in the interfacial Mg₂Cu layer and the existence of Dirac nodal lines near the Fermi level. The new 2D Mg₂Cu material emerges as a promising platform to study new topological states of matter.

View Accepted Manuscript (DOE)

Research Organization:: Brookhaven National Laboratory (BNL), Upton, NY (United States)

Sponsoring Organization:: Gordon and Betty Moore Foundation; USDOE; USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division

Grant/Contract Number:: SC0012704

OSTI ID:: 1838159

Alternate ID(s):: OSTI ID: 1847025

Report Number(s):: BNL--222569-2021-JAAM

Journal Information:: Advanced Electronic Materials, Journal Name: Advanced Electronic Materials Journal Issue: 3 Vol. 8; ISSN 2199-160X

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

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2D Mg-Cu Intermetallic Compounds with Nontrivial Band Topology and Dirac Nodal Lines

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