Microstructural Analysis of Cadmium Whiskers on Long-Term-Used Hardware

White, Rachel; Ghanbari, Zahra; Susan, Donald; Dickens, Sara; Ruggles, Timothy; Perry, Daniel

doi:10.1007/s11661-021-06512-1

Microstructural Analysis of Cadmium Whiskers on Long-Term-Used Hardware

Journal Article · Mon Nov 15 23:00:00 EST 2021 · Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science

DOI:https://doi.org/10.1007/s11661-021-06512-1· OSTI ID:1827612

White, Rachel ^[1]; Ghanbari, Zahra ^[1]; Susan, Donald ^[1]; Dickens, Sara ^[1]; Ruggles, Timothy ^[1]; Perry, Daniel ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

A survey of cadmium plated field return hardware showed ubiquitous cadmium whisker growth. The most worn and debris-covered hardware showed the densest whisker growth. Whiskers were often found growing in agglomerates of nodules and whiskers. The hardware was rinsed with alcohol to transfer whiskers and debris from the hardware to a flat stub. Fifty whiskers were studied individually by scanning electron microscopy (SEM), including energy dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD). Most of the whiskers were single crystal, though three were found to contain grain boundaries at kinks. The whiskers ranged from 5 to 600 μm in length and 80 pct showed a $$<\bar{1} 2 \bar{1} 0>$$ type growth direction. This growth direction facilitates the development of low energy side faces of the whisker, (0001) and {1010}.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0003525

OSTI ID:: 1827612

Report Number(s):: SAND2021-12476J; 700675

Journal Information:: Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science, Journal Name: Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science Journal Issue: 1 Vol. 53; ISSN 1073-5623

Publisher:: ASM InternationalCopyright Statement

Country of Publication:: United States

Language:: English

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