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Modular Multilevel Converter (MMC) Modeling Considering Submodule Voltage Sensor Noise

Journal Article · · IEEE Transactions on Power Electronics

The modular multilevel converter (MMC) is a popular topology in medium- and high-voltage applications, and many efforts have been spent on MMC modeling. However, the impact of submodule voltage sensor noise (SVSN), which becomes more severe due to increasing switching speed of power semiconductors and compact submodule design, has not been considered in conventional models. In this letter, the SVSN is introduced by coupling capacitances between the sensor and power stage in an MMC switching model. Furthermore, the SVSN impact is considered in an MMC average model based on derivation of the relationship between the SVSN and the duty cycle. Here, the proposed MMC switching model and average model considering the SVSN are validated by comparing simulations with experimental results in an MMC prototype using 10-kV SiC MOSFETS.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Electricity Delivery and Energy Reliability (OE)
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1808183
Journal Information:
IEEE Transactions on Power Electronics, Journal Name: IEEE Transactions on Power Electronics Journal Issue: 2 Vol. 36; ISSN 0885-8993
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English