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Impact of interconnection failure on photovoltaic module performance

Journal Article · · Progress in Photovoltaics
DOI:https://doi.org/10.1002/pip.3401· OSTI ID:1804820
 [1];  [2];  [3]
  1. Materials Science and Engineering University of Central Florida Orlando FL USA, FSEC Energy Research Center Cocoa FL USA, Resilient Intelligent Sustainable Energy Systems (RISES) Faculty Cluster University of Central Florida Orlando FL USA
  2. Materials Science and Engineering University of Central Florida Orlando FL USA
  3. Materials Science and Engineering University of Central Florida Orlando FL USA, FSEC Energy Research Center Cocoa FL USA, College of Optics and Photonics University of Central Florida Orlando FL USA, Resilient Intelligent Sustainable Energy Systems (RISES) Faculty Cluster University of Central Florida Orlando FL USA
Abstract

Understanding the impact of failures on performance is necessary for any technology's development. There are many interconnection schemes that have emerged as the field solar photovoltaics has matured, but the most commonly used and well‐understood scheme is ribbon tabbing. In the field, the contacts between the ribbons and the cell metallization can fail via corrosion or solder joint failure. Solder joint failures are simulated by systematically cutting the interconnections of four‐busbar, multicrystalline silicon modules. It is shown that not only do the failures themselves contribute to performance loss but the location of the failed interconnection with respect to those near it is also important. Different breakage schemes and their impact on performance are compared. Different methods of calculating series resistance are evaluated. Multi‐irradiance performance is used to show how energy yield models can inaccurately predict module output for modules with high series resistance.

Sponsoring Organization:
USDOE
Grant/Contract Number:
EE0008155
OSTI ID:
1804820
Alternate ID(s):
OSTI ID: 1848688
Journal Information:
Progress in Photovoltaics, Journal Name: Progress in Photovoltaics Journal Issue: 5 Vol. 29; ISSN 1062-7995
Publisher:
Wiley Blackwell (John Wiley & Sons)Copyright Statement
Country of Publication:
United Kingdom
Language:
English

References (13)

Quantifying and modeling the impact of interconnection failures on the electrical performance of crystalline silicon photovoltaic modules
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  • Progress in Photovoltaics: Research and Applications, Vol. 27, Issue 5 https://doi.org/10.1002/pip.3111
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Quantitative estimation of electrical performance parameters of individual solar cells in silicon photovoltaic modules using electroluminescence imaging journal October 2018
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Shockley–Queisser triangle predicts the thermodynamic efficiency limits of arbitrarily complex multijunction bifacial solar cells journal November 2019
Electrical Signatures of Corrosion and Solder Bond Failure in c-Si Solar Cells and Modules journal May 2019
Dark Lock-in Thermography Identifies Solder Bond Failure as the Root Cause of Series Resistance Increase in Fielded Solar Modules journal September 2020
Quantitative analysis of crystalline silicon wafer PV modules by electroluminescence imaging conference June 2016
Extracting Cell Level Characteristics from Photovoltaic Module Electroluminescence Images conference June 2019
The Impact of Cracked Solar Cells on Solar Panel Energy Delivery conference June 2020

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