Large Nuclear Detector Array Interconnection by Direct-Write Laser Chemical Vapor Deposition (CVD)
SUMMARY OF PHASE I RESEARCH The primary technical objective stated in the proposal was to demonstrate Laser CVD feasibility to 3D print metallic interconnect structures on planar and vertical surfaces for the DOE large detector application. We listed our Technical Objectives as follows : Design and build the proposed prototype 3D localized laser CVD AM printing system Operate the prototype apparatus to deposit a metallic thin film on polished and non- polished substrate surfaces using a fixed beam and X-Y-Z positioning stage Characterize the properties of the deposited thin film Consolidate subsystems into one single computer control system. Results of Phase I R&D During this project our existing prototype was upgraded to perform 2D deposition, with excellent results for printing high-resolution (100 µm line width) conductive Nickel and Tungsten metal patterns on Aluminum Oxide (Al2O3) substrate. The computer control code was improved to provide complex pattern design and laser deposition parameter exploration. Electrical testing of printed lines showed increase in resistance with increased laser power, gas flow, and vacuum pressure. Other variables (such as substrate surface roughness) can also affect line resistance. We also designed and procured parts for the next prototype version featuring 3D substrate positioning, precision optics, and larger printing area. The 3D system has been fully assembled and we are completing subsystem integration. The new laser CVD printing prototype will be capable of 2D and 2.5D deposition from industry-standard CAD/CNC part files, as well as vertical deposition. Conformal printing capability can be demonstrated with additional substrate motion axes. Potential Applications of This Research Direct-Write Laser CVD technology has competitive advantages for printing conductive electrical circuits, interconnects, and antennas. Our Phase I printed samples enabled us to partner with antenna and substrate technology companies towards antenna miniaturization opportunities. The U.S. printed antenna market alone will reach $880M annually by 2025. Laser CVD can print circuits on a broader range of materials, in multiple dimensions, and with greater durability than industry-standard ink or paste printing methods. Laser CVD printed circuits using non-traditional materials can withstand extreme temperatures, harsh environments, and radiation. The Phase I Laser CVD R&D has been successful and shows promise for building a direct-writing system for sales to potential customers markets described in our Phase II Commercialization Plan. The robust design and innovative industrial laser CVD AM system will improve U.S. global competitiveness. Jobs will be created as our product commercialization expands market share. Environmental impact will be reduced by efficient laser CVD gas feedstock use and reduced post-processing steps.
- Research Organization:
- Microcvd Corporation
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- SC0020529
- OSTI ID:
- 1772559
- Type / Phase:
- SBIR (Phase I)
- Report Number(s):
- Microcvd-DOE-DE-SC0020529
- Country of Publication:
- United States
- Language:
- English
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