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Cathode system for electrodeposition of metals on microspheres

Patent ·
OSTI ID:1771677
The present disclosure relates to an apparatus for electroplating an element. The apparatus may comprise a cathode cage assembly. The cathode cage assembly may include a cage member and at least one electrically conductive wire extending along at least a portion of the cage member. The wire may be arranged to form at least one volume within the cage member for retaining an element within the cage member. The cage member and the wire permit a degree of movement of the element during an electroplating process while retaining the element within the volume.
Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-07NA27344
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Number(s):
10,844,507
Application Number:
15/965,317
OSTI ID:
1771677
Country of Publication:
United States
Language:
English

References (5)

Metallic coating of microspheres journal April 1981
Phenomenological Model for Gold-Copper Electrodeposition: Application to Thick Coatings journal September 2016
Nanocrystalline growth and grain-size effects in Au–Cu electrodeposits journal January 2006
The thermal stability of nanocrystalline Au–Cu alloys journal November 2006
Influence of the Electrochemical Parameters on the Properties of Electroplated Au-Cu Alloys journal January 2011

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