Materials Data on TmIn7Cu5 by Materials Project
TmCu5In7 crystallizes in the orthorhombic Imm2 space group. The structure is three-dimensional. Tm is bonded in a 8-coordinate geometry to ten Cu and ten In atoms. There are a spread of Tm–Cu bond distances ranging from 3.52–3.66 Å. There are a spread of Tm–In bond distances ranging from 3.13–3.54 Å. There are two inequivalent Cu sites. In the first Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Tm, three Cu, and seven In atoms. There are a spread of Cu–Cu bond distances ranging from 2.73–2.84 Å. There are a spread of Cu–In bond distances ranging from 2.70–2.98 Å. In the second Cu site, Cu is bonded in a 12-coordinate geometry to two equivalent Tm, four equivalent Cu, and six In atoms. There are a spread of Cu–In bond distances ranging from 2.76–2.99 Å. There are five inequivalent In sites. In the first In site, In is bonded in a 5-coordinate geometry to one Tm, four equivalent Cu, and five In atoms. There are a spread of In–In bond distances ranging from 3.01–3.17 Å. In the second In site, In is bonded in a 8-coordinate geometry to one Tm, six Cu, and three In atoms. Both In–In bond lengths are 3.31 Å. In the third In site, In is bonded in a 10-coordinate geometry to one Tm, five Cu, and four In atoms. There are a spread of In–In bond distances ranging from 3.05–3.12 Å. In the fourth In site, In is bonded in a 12-coordinate geometry to two equivalent Tm, four equivalent Cu, and six In atoms. Both In–In bond lengths are 2.93 Å. In the fifth In site, In is bonded in a 12-coordinate geometry to two equivalent Tm, five Cu, and five In atoms.
- Research Organization:
- LBNL Materials Project; Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
- Contributing Organization:
- The Materials Project; MIT; UC Berkeley; Duke; U Louvain
- DOE Contract Number:
- AC02-05CH11231
- OSTI ID:
- 1758917
- Report Number(s):
- mp-1216978
- Country of Publication:
- United States
- Language:
- English
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