Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Defect suppression in wet-treated etched-and-regrown nonpolar m-plane GaN vertical Schottky diodes: A deep-level optical spectroscopy analysis

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/5.0018829· OSTI ID:1725854
In this work, steady-state photocapacitance (SSPC) was conducted on nonpolar m-plane GaN n-type Schottky diodes to evaluate the defects induced by inductively coupled plasma (ICP) dry etching in etched-and-regrown unipolar structures. An ~10× increase in the near-midgap Ec – 1.9 eV level compared to an as-grown material was observed. Defect levels associated with regrowth without an etch were also investigated. The defects in the regrown structure (without an etch) are highly spatially localized to the regrowth interface. Subsequently, by depth profiling an etched-and-regrown sample, we show that the intensities of the defect-related SSPC features associated with dry etching depend strongly on the depth away from the regrowth interface, which is also reported previously. A photoelectrochemical etching (PEC) method and a wet AZ400K treatment are also introduced to reduce the etch-induced deep levels. A significant reduction in the density of deep levels is observed in the sample that was treated with PEC etching after dry etching and prior to regrowth. An ~2× reduction in the density of Ec – 1.9 eV level compared to a reference etched-and-regrown structure was observed upon the application of PEC etching treatment prior to the regrowth. The PEC etching method is promising for reducing defects in selective-area doping for vertical power switching structures with complex geometries.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Advanced Research Projects Agency - Energy (ARPA-E); USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000; NA0003525
OSTI ID:
1725854
Alternate ID(s):
OSTI ID: 1712792
Report Number(s):
SAND--2020-12895J; 692401
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 18 Vol. 128; ISSN 0021-8979
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

References (44)

Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges journal December 2017
Interfacial Impurities and Their Electronic Signatures in High‐Voltage Regrown Nonpolar m‐ Plane GaN Vertical p–n Diodes journal December 2019
GaN Technology for Power Electronic Applications: A Review journal March 2016
Removal of Dry-Etch-Induced Surface Layer Damage from p-GaN by Photoelectrochemical Etching journal February 2020
Impurity incorporation in heteroepitaxial N-face and Ga-face GaN films grown by metalorganic chemical vapor deposition journal March 2008
Crystallographic orientation dependence of dopant and impurity incorporation in GaN films grown by metalorganic chemical vapor deposition journal July 2009
Effect of carrier gas and substrate misorientation on the structural and optical properties of m-plane InGaN/GaN light-emitting diodes journal December 2010
Wet etching of GaN, AlN, and SiC: a review journal January 2005
Design of high breakdown voltage vertical GaN p-n diodes with high-K/low-K compound dielectric structure for power electronics applications journal November 2017
Room‐temperature photoenhanced wet etching of GaN journal March 1996
Depth and thermal stability of dry etch damage in GaN Schottky diodes journal July 1999
Electrical effects of plasma damage in p-GaN journal October 1999
Hydrogen passivation of deep levels in n–GaN journal September 2000
Observation of inductively coupled-plasma-induced damage on n -type GaN using deep-level transient spectroscopy journal February 2003
Dislocation- and crystallographic-dependent photoelectrochemical wet etching of gallium nitride journal April 2004
A method to determine deep level profiles in highly compensated, wide band gap semiconductors journal April 2005
Impact of deep levels on the electrical conductivity and luminescence of gallium nitride codoped with carbon and silicon journal September 2005
Assessment of deep level defects in m -plane GaN grown by metalorganic chemical vapor deposition journal February 2012
Nonpolar III-nitride vertical-cavity surface emitting lasers with a polarization ratio of 100% fabricated using photoelectrochemical etching journal July 2014
Proton irradiation effects on minority carrier diffusion length and defect introduction in homoepitaxial and heteroepitaxial n-GaN journal December 2017
Investigation of GaN-on-GaN vertical p - n diode with regrown p -GaN by metalorganic chemical vapor deposition journal December 2018
Investigation of dry-etch-induced defects in >600 V regrown, vertical, GaN, p-n diodes using deep-level optical spectroscopy journal October 2019
Determination of electronic band structure by electron holography of etched-and-regrown interfaces in GaN p-i-n diodes journal November 2019
Current status and scope of gallium nitride-based vertical transistors for high-power electronics application journal June 2013
Low damage dry etch for III-nitride light emitters journal July 2015
Diffusivity of native defects in GaN journal January 2004
Detection of Interstitial Ga in GaN journal September 2000
GaN n- and p-type Schottky diodes: Effect of dry etch damage journal July 2000
Reverse Leakage Analysis for As-grown and Regrown Vertical GaN-on-GaN Schottky Barrier Diodes journal January 2020
Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges journal September 2016
400-A (Pulsed) Vertical GaN p-n Diode With Breakdown Voltage of 700 V journal June 2014
1.5-kV and 2.2-m \(\Omega \) -cm \(^{2}\) Vertical GaN Transistors on Bulk-GaN Substrates journal September 2014
Vertical GaN Junction Barrier Schottky Rectifiers by Selective Ion Implantation journal August 2017
High-Voltage Regrown Nonpolar ${m}$ -Plane Vertical p-n Diodes: A Step Toward Future Selective-Area-Doped Power Switches journal March 2019
Demonstration of 1.27 kV Etch-Then-Regrow GaN ${p}$ -${n}$ Junctions With Low Leakage for GaN Power Electronics journal November 2019
Vertical Power p-n Diodes Based on Bulk GaN journal February 2015
Design of 1.2 kV Power Switches With Low $R_{\mathrm{{\scriptscriptstyle ON}}}$ Using GaN-Based Vertical JFET journal August 2015
Vertical GaN Power Diodes With a Bilayer Edge Termination journal January 2016
Dynamic Modeling and Power Loss Analysis of High-Frequency Power Switches Based on GaN CAVET journal October 2016
Indium and impurity incorporation in InGaN films on polar, nonpolar, and semipolar GaN orientations grown by ammonia molecular beam epitaxy
  • Browne, David A.; Young, Erin C.; Lang, Jordan R.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 4 https://doi.org/10.1116/1.4727967
journal July 2012
Schottky diode measurements of dry etch damage in n - and p -type GaN
  • Cao, X. A.; Zhang, A. P.; Dang, G. T.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 18, Issue 4 https://doi.org/10.1116/1.582314
journal July 2000
Mechanism of Yellow Luminescence in GaN journal December 1980
Etching Damages on AlGaN, GaN and InGaN Caused by Hybrid Inductively Coupled Plasma Etch and Photoenhanced Chemical Wet Etch by Schottky Contact Characterizations journal July 2003
1.8 mΩ·cm 2 vertical GaN-based trench metal–oxide–semiconductor field-effect transistors on a free-standing GaN substrate for 1.2-kV-class operation journal April 2015

Similar Records

Investigation of dry-etch-induced defects in >600 V regrown, vertical, GaN, p-n diodes using deep-level optical spectroscopy
Journal Article · Wed Oct 09 20:00:00 EDT 2019 · Journal of Applied Physics · OSTI ID:1574450