Development of a Scalable Two-Additive Electrodeposition System for Bottom-Up Copper Filling of Sub-Millimeter Through Silicon Vias.

Conference · Fri Nov 01 00:00:00 EDT 2019

DOI:https://doi.org/10.1149/MA2020-01181151mtgabs· OSTI ID:1643295

Menk, Lyle Alexander; Schmitt, Rebecca P.; Jordan, Matthew; Sadler, Corrie Lynn; Hollowell, Andrew E

Abstract not provided.

• Research Organization: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1643295
• Report Number(s): SAND2019-13978C; 681520
• Country of Publication: United States
• Language: English