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Title: Circuit board interconnect decals

Patent ·
OSTI ID:1632422
;

A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.

Research Organization:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
NA0000622
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Number(s):
10,531,568
Application Number:
16/253,362
OSTI ID:
1632422
Resource Relation:
Patent File Date: 01/22/2019
Country of Publication:
United States
Language:
English

References (15)

Electro-Optic Display Backplane Structures with Drive Components and Pixel Electrodes on Opposed Surfaces patent-application July 2018
Semiconductor package including flex circuit, interconnects and dense array external contacts patent October 2002
Method for molding a multilayered trim component patent October 1997
Method of Manufacturing Circuit Layout on Touch Panel by Utilizing Metal Plating Technology patent-application November 2005
Fabric, a Device with Fabric and a Manufacturing Method for Fabric patent-application September 2011
Multi-Layer Connecting Structures for Packaging Semiconductor Devices Mounted on a Flexible Carrier patent February 1975
Printed Circuit Process and Articles patent March 1972
Method for Manufacturing Printed Circuit Board patent-application May 2009
Substrate Comprising an Electrical Circuit Pattern, Method and System for Providing Same patent-application September 2016
Explosive Bonding of Workpieces patent June 1973
Method of transferring an inorganic image patent May 1991
Method for manufacturing a substrate having window-shaped coating films and frame-shaped coating film on the surface thereof patent October 1996
Method of Forming Circuit Pattern on Printed Circuit Board patent-application March 2007
Printable Films for Printed Circuit Boards and Processes for Making Same patent-application May 2017
Process for Forming Metal Micro-Patterns on Plastic Substrate patent-application February 2003

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