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Title: Performance of new radiation-tolerant thin planar and 3D columnar n + on p silicon pixel sensors up to a maximum fluence of ~ 5 × 1 0 15 n eq /cm 2

Journal Article · · Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment
 [1];  [2];  [3];  [4];  [5];  [6];  [7];  [3];  [8];  [9];  [7];  [10];  [6];  [3];  [10];  [8];  [11];  [5]
  1. Fondazione Bruno Kessler, Trento (Italy); TIFPA-INFN, Trenton (Italy)
  2. Univ. degli Studi (Italy); National Inst. of Nuclear Physics (INFN), Firenze (Italy)
  3. TIFPA-INFN, Trenton (Italy); Univ. di Trento (Italy)
  4. National Inst. of Nuclear Physics (INFN), Genova (Italy)
  5. Univ. degli Studi di Milano-Bicocca, Milano (Italy); INFN-Bicocca, Milano (Italy)
  6. Fondazione Bruno Kessler, Trento (Italy)
  7. INFN-Bicocca, Milano (Italy)
  8. National Inst. of Nuclear Physics (INFN), Firenze (Italy)
  9. Univ. degli Studi di Pisa (Italy); National Inst. of Nuclear Physics (INFN), Pisa (Italy)
  10. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
  11. Hamburg Univ. (Germany)

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1 0 16 n eq /cm 2 at ~ 3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n + on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100 μ m or 130 μ m , that of 3D sensors 130 μ m . First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. Finally, first results on their performance before and after irradiation up to a maximum fluence of ~ 5 × 1 0 15 n eq /cm 2 are reported in this article.

Research Organization:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), High Energy Physics (HEP)
Grant/Contract Number:
AC02-07CH11359; 654168
OSTI ID:
1616318
Report Number(s):
FERMILAB-PUB-20-147-SCD; oai:inspirehep.net:1770383; TRN: US2106441
Journal Information:
Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 953, Issue C; ISSN 0168-9002
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 6 works
Citation information provided by
Web of Science

References (10)

The geometrical dependence of radiation hardness in planar and 3D silicon detectors
  • DaVia, C.; Watts, S. J.
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journal May 2009
Frontend electronics development for the CMS pixel detector upgrade journal December 2013
Development of a new generation of 3D pixel sensors for HL-LHC
  • Dalla Betta, G. -F.; Boscardin, M.; Darbo, G.
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 824 https://doi.org/10.1016/j.nima.2015.08.032
journal July 2016
Straggling in thin silicon detectors journal July 1988
Small pitch 3D devices
  • Dalla Betta, Gian-Franco; Mendicino, Roberto; Sultan, D. M. S.
  • Proceedings of The 25th International workshop on vertex detectors — PoS(Vertex 2016) https://doi.org/10.22323/1.287.0028
conference August 2017
The pixel tracking telescope at the Fermilab Test Beam Facility
  • Kwan, Simon; Lei, Cm; Menasce, Dario
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 811 https://doi.org/10.1016/j.nima.2015.12.003
journal March 2016
Review of Particle Physics journal August 2018
INFN-FBK developments of 3D sensors for High-Luminosity LHC
  • Oide, H.; Alimonti, G.; Boscardin, M.
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 924 https://doi.org/10.1016/j.nima.2018.10.022
journal April 2019
Performance of thin planar n-on-p silicon pixels after HL-LHC radiation fluences
  • Ducourthial, A.; Bomben, M.; Calderini, G.
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 927 https://doi.org/10.1016/j.nima.2019.02.033
journal May 2019
First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×10 16 neq cm −2 journal June 2019

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