Revealing nanoscale dynamics during an epoxy curing reaction with x-ray photon correlation spectroscopy

Yavitt, Benjamin M.; Salatto, Daniel; Huang, Zhixing; Koga, Yuto T.; Endoh, Maya K.; Wiegart, Lutz; Poeller, Sascha; Petrash, Stanislas; Koga, Tadanori

doi:10.1063/1.5141488

Title: Revealing nanoscale dynamics during an epoxy curing reaction with x-ray photon correlation spectroscopy

Journal Article · Tue Mar 17 00:00:00 EDT 2020 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.5141488· OSTI ID:1614979

^[1]; Salatto, Daniel ^[2]; Huang, Zhixing ^[2]; Koga, Yuto T. ^[3]; Endoh, Maya K. ^[2]; Wiegart, Lutz ^[4];

^[5]; Petrash, Stanislas ^[6];

^[2]

Stony Brook Univ., NY (United States); Brookhaven National Lab. (BNL), Upton, NY (United States). National Synchrotron Light Source II (NSLS-II)
Stony Brook Univ., NY (United States)
Cornell Univ., Ithaca, NY (United States)
Brookhaven National Lab. (BNL), Upton, NY (United States). National Synchrotron Light Source II (NSLS-II)
Adhesive Technologies, Duesseldorf (Germany); Henkel AG & Co KGaA, Duesseldorf (Germany)
Adhesive Technologies, Henkel Corporation, Bridgewater, NJ (United States)

In this work the evolution of nanoscale properties is measured during the thermally triggered curing of an industrial epoxy adhesive. We use x-ray photon correlation spectroscopy (XPCS) to track the progression of the curing reaction through the local dynamics of filler particles that reflect the formation of a thermoset network. Out-of-equilibrium dynamics are resolved through identification and analysis of the intensity– intensity autocorrelation functions obtained from XPCS. The characteristic time scale and local velocity of the filler is calculated as functions of time and temperature. We find that the dynamics speed up when approaching the curing temperature (T_cure), and decay rapidly once T_cure is reached. We compare the results from XPCS to conventional macroscale characterization by differential scanning calorimetry (DSC). The demonstration and implementation of nanoscale characterization of curing reactions by XPCS proves useful for future development and optimization of epoxy thermoset materials and other industrial adhesive systems.

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Research Organization:: Brookhaven National Laboratory (BNL), Upton, NY (United States). Center for Functional Nanomaterials (CFN) and National Synchrotron Light Source II (NSLS-II)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES); Henkel Corporation

Grant/Contract Number:: SC0012704

OSTI ID:: 1614979

Alternate ID(s):: OSTI ID: 1605042

Report Number(s):: BNL-213842-2020-JAAM; TRN: US2104970

Journal Information:: Journal of Applied Physics, Vol. 127, Issue 11; ISSN 0021-8979

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 11 works

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