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Title: Plasma etching of high aspect ratio features in SiO 2 using Ar/C 4 F 8 /O 2 mixtures: A computational investigation

Journal Article · · Journal of Vacuum Science and Technology A
DOI:https://doi.org/10.1116/1.5090606· OSTI ID:1612098

Not provided.

Research Organization:
Univ. of Michigan, Ann Arbor, MI (United States)
Sponsoring Organization:
USDOE Office of Science (SC)
DOE Contract Number:
SC0014132
OSTI ID:
1612098
Journal Information:
Journal of Vacuum Science and Technology A, Vol. 37, Issue 3; ISSN 0734-2101
Publisher:
American Vacuum Society / AIP
Country of Publication:
United States
Language:
English