Plasma etching of high aspect ratio features in SiO 2 using Ar/C 4 F 8 /O 2 mixtures: A computational investigation
Journal Article
·
· Journal of Vacuum Science and Technology A
- Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Ave., Ann Arbor, Michigan 48109-2122
- Samsung Electronics Co., Ltd., 129 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-742, Republic of Korea
Not provided.
- Research Organization:
- Univ. of Michigan, Ann Arbor, MI (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- SC0014132
- OSTI ID:
- 1612098
- Journal Information:
- Journal of Vacuum Science and Technology A, Vol. 37, Issue 3; ISSN 0734-2101
- Publisher:
- American Vacuum Society / AIP
- Country of Publication:
- United States
- Language:
- English
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