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New Directions in Thermoelectric and Thermal-Electric Cooling

Conference · · Proceedings of the SPIE Photonics West 2017
OSTI ID:1608466
Conventional thermoelectric coolers have been widely used for cooling of electronic devices. Utilizing bismuth telluride materials, these Peltier modules are typically categorized as high heat flux devices that can achieve modest temperature differences in a compact architecture. Breaking from convention of typical bismuth telluride thermoelectric devices, an alternative method of providing thermal-electric cooling will be discussed providing inspiration for new cooling directions and materials challenges. While this approach has application in electric cooling of solids, there are also wider applications including space cooling and heat pumping.
Research Organization:
Georgia Tech Research Corporation, Atlanta, GA (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Solar Energy Technologies Office (EE-4S)
DOE Contract Number:
EE0007110
OSTI ID:
1608466
Report Number(s):
DOI: 10.1117/12.2257359
Conference Information:
Journal Name: Proceedings of the SPIE Photonics West 2017
Country of Publication:
United States
Language:
English

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