Creep performance of transient liquid phase bonded haynes 230 alloy

Rozman, K. A.; Carl, M. A.; Kapoor, M.; Doğan, Ö. N.; Hawk, J. A.

doi:10.1016/j.msea.2019.138477

Creep performance of transient liquid phase bonded haynes 230 alloy

Journal Article · Mon Sep 30 00:00:00 EDT 2019 · Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing

DOI:https://doi.org/10.1016/j.msea.2019.138477· OSTI ID:1607751

Rozman, K. A. ^[1]; Carl, M. A. ^[2]; Kapoor, M. ^[3]; Doğan, Ö. N. ^[4]; Hawk, J. A. ^[4]

National Energy Technology Lab. (NETL), Albany, OR (United States); Leidos Research Support Team, Pittsburgh, PA (United States)
ATI Metals, Pittsburgh, PA (United States)
Novelis Aditya Birla, Atlanta, GA (United States)
National Energy Technology Lab. (NETL), Albany, OR (United States)

In this study, creep performance of a potential heat exchanger alloy, Haynes 230 was investigated. To simulate mechanical performance of a heat exchanger, sheet material of Haynes 230 transient liquid phase (TLP) bonded together. Sheets were plated on both sides with a Ni–P compound, subsequently stacked and TLP bonded together. Duplicate creep tests show low scatter in creep results, meaning a good repeatable joint was formed by TLP bonding. Overall creep performance showed less ductility and shorter times to failure than specimens originating from plate material. Lastly, evolution of a phosphorous compound at the bond line was observed and thought to potentially reduce ductility of the TLP bonded alloy.

View Accepted Manuscript (DOE)

Research Organization:: National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV, and Albany, OR (United States)

Sponsoring Organization:: USDOE Office of Fossil Energy (FE)

Grant/Contract Number:: 89243318CFE000003

OSTI ID:: 1607751

Alternate ID(s):: OSTI ID: 1571671

Journal Information:: Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing, Journal Name: Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing Journal Issue: C Vol. 768; ISSN 0921-5093

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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