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Atomic and electronic structures of lattice mismatched Cu2O/TiO2 interfaces

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4880942· OSTI ID:1565180
 [1];  [2];  [3];  [3];  [4];  [5];  [5]
  1. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Materials Sciences Division; Google Inc., Mountain View, CA (United States)
  2. Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Engineering; India Inst. of Technology, Bombay (India)
  3. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Materials Science and Engineering
  4. Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Engineering
  5. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Materials Sciences Division; Joint Center of Artificial Photosynthesis, Berkeley, CA (United States)
Heterojunction interfaces between metal oxides are often highly lattice mismatched. The atomic and electronic structures of such interfaces, however, are not well understood. Here, we have synthesized Cu2O/TiO2 heterojunction thin films with 13% lattice mismatch and studied the interface via experimental methods and large-scale density function theory calculations of supercells containing 1300 atoms. We find that an interface of epitaxial quality is formed via a coincidence site lattice of 8 Cu2O unit cells matching 9 TiO2 unit cells. Calculations reveal the existence of a dislocation core of the O sublattices at the interface and a random arrangement of one layer of interfacial Cu atoms. The interfacial electronic structure is found to be mostly determined by the interfacial Cu distribution, rather than by the O dislocation core. The conduction band minimum and valence band maximum states are spatially separated, and there is no strongly localized state near the core.
Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States); Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Oak Ridge Leadership Computing Facility (OLCF)
Sponsoring Organization:
USDOE Office of Science (SC)
Grant/Contract Number:
AC02-05CH11231
OSTI ID:
1565180
Alternate ID(s):
OSTI ID: 22300113
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 21 Vol. 104; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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