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Title: Ignition thresholds of aluminized HMX-based polymer-bonded explosives

Journal Article · · AIP Advances
DOI:https://doi.org/10.1063/1.5052632· OSTI ID:1558557

Here, the ignition of aluminized HMX-based polymer-bonded explosives (PBXs) under shock loading is studied via mesoscale simulations. The conditions analyzed concern loading pulses of 20 nanoseconds to 0.8 microseconds in duration and impact piston velocities on the order of 400-1000 m/s or loading stresses on the order of 3-14 GPa. The sets of samples studied have stochastically similar microstructures consisting of a bimodal distribution of HMX grains, an Estane binder, and aluminum particles 50-100 µm in diameter. The computational model accounts for constituent elasto-viscoplasticity, viscoelasticity, bulk compressibility, fracture, interfacial debonding, internal contact, bulk and frictional heating, and heat conduction. The analysis focuses on the development of hotspots under different material settings and loading conditions. In particular, the ignition thresholds in the forms of the James relation and the Walker-Wasley relation and the corresponding ignition probability are calculated and expressed as functions of the aluminum volume fraction for the PBXs analyzed. Lastly, it is found that the addition of aluminum raises the ignition thresholds, causing the materials to be less sensitive. Dissipation and heating mechanism changes responsible for this trend are delineated.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC05-00OR22725; NA0003864
OSTI ID:
1558557
Journal Information:
AIP Advances, Vol. 9, Issue 4; ISSN 2158-3226
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 6 works
Citation information provided by
Web of Science

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Cited By (1)

Prediction of Probabilistic Detonation Threshold via Millimeter‐Scale Microstructure‐Explicit and Void‐Explicit Simulations journal November 2019

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