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Title: Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime

Abstract

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200 degrees C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

Authors:
ORCiD logo [1]
  1. National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1557084
Report Number(s):
NREL/PR-5400-73551
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at the 2019 Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 10-13 June 2019, Arlington, Virginia
Country of Publication:
United States
Language:
English
Subject:
33 ADVANCED PROPULSION SYSTEMS; wide-bandgap device packaging; sintered silver; reliability; lifetime prediction models

Citation Formats

Paret, Paul P. Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime. United States: N. p., 2019. Web.
Paret, Paul P. Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime. United States.
Paret, Paul P. Wed . "Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime". United States. https://www.osti.gov/servlets/purl/1557084.
@article{osti_1557084,
title = {Power Electronics Materials and Bonded Interfaces - Reliability and LIfetime},
author = {Paret, Paul P},
abstractNote = {The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200 degrees C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {8}
}

Conference:
Other availability
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