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Dopant Patterning by PECVD and Mechanical Masking for Passivated Tunneling Contact IBC Cell Architectures

Conference ·
We present a robust, simple technique for dopant patterning onto poly-Si/SiO 2 passivated tunneling contacts on nCz wafers. Heavily doped, thin nand ptype a-Si:H overlayers serve as solid-state dopant sources for blanket intrinsic a-Si:H layer on tunneling SiO 2 . Subsequent processing results in uniformly doped, functional n- and p-type passivated contacts. Furthermore, physical masking during the PECVD of the dopant source overlayers enables an interdigitated back contact (IBC) cell structure with sufficient doped finger edge fidelity to preserve an intrinsic electrode gap. Lithography-free, passivated contact IBC cell structures are made using a set of n-, p-, and metallization masks from patterned Si wafers with mechanical alignment. Alternatively, doped a-Si:H overlayers are patterned by dielectric layer deposition and lithography.
Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Solar Energy Technologies Office (EE-4S)
DOE Contract Number:
AC36-08GO28308
OSTI ID:
1544978
Report Number(s):
NREL/CP-5900-67894
Country of Publication:
United States
Language:
English