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IRPS Increases its Coverage of SiC and GaN

Journal Article · · Compound Semiconductor
OSTI ID:1544809
 [1];  [2];  [3]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  2. Univ. of Padova (Italy)
  3. U.S. Army Research Lab, Adelphi, MD (United States)

Over the past few years, interest has rocketed in the use of wide bandgap devices for energy-efficiency applications such as the electric grid, vehicle electrification, and more-electric aircraft. Deployed in these situations, devices must have a high reliability. In fact, this attribute is so crucial that it is a primary gatingfactor, determining the rate at which these wide bandgap devices are being inserted into these system applications.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1544809
Report Number(s):
SAND--2019-7771J; 677187
Journal Information:
Compound Semiconductor, Journal Name: Compound Semiconductor Journal Issue: 4 Vol. 25; ISSN 1096-598X
Publisher:
Angel Business CommunicationsCopyright Statement
Country of Publication:
United States
Language:
English

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