Multimaterial Aerosol Jet Printing of Passive Circuit Elements+.

Conference · Fri Jun 01 00:00:00 EDT 2018

OSTI ID:1531300

Johannes, Seth; Keicher, David; Lavin, Judith Maria; Secor, Ethan Benjamin; Whetten, Shaun R; Essien, Marcelino

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1531300
• Report Number(s): SAND2018-7056C; 665290
• Resource Relation: Conference: Proposed for presentation at the Solid Freeform Fabrication Symposium held August 13-15, 2018 in Austin, Texas, United States.
• Country of Publication: United States
• Language: English