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Title: Acoustic Mismatch Model for Thermal Contact Conductance of Van Der Waals Contacts Under Static Force

Journal Article · · Nanoscale and Microscale Thermophysical Engineering
 [1]
  1. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Univ. of California, Berkeley, CA (United States)

We report that Van der Waals interfaces play a major role in technology today. Thermal transport in material systems with van der Waals interfaces is mainly limited by the contact conductance. Although the effects of static force, such as pressure or the electrostatic part of hydrogen bonds, on the thermal contact conductance of van der Waals interfaces have been examined in a few studies, the focus was either on numerical simulation using techniques such as molecular dynamics or on experimental investigation. In this article, an analytical model of thermal contact conductance that accounts for the effects of static force and adhesion energy is presented. The application of static forces is found to cause a decrease in the intermolecular distance, which leads to increased interatomic forces across the interfaces and thus higher thermal conductance. The model is in good agreement with experimental data on the effect of pressure on thermal conductance collected by Gotsmann and Lantz (Nature Materials, Vol. 12, p. 59–65, 2012).

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Energy Efficiency Office. Building Technologies Office
Grant/Contract Number:
AC02-05CH11231
OSTI ID:
1508056
Journal Information:
Nanoscale and Microscale Thermophysical Engineering, Vol. 22, Issue 1; ISSN 1556-7265
Publisher:
Taylor & FrancisCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 6 works
Citation information provided by
Web of Science

References (13)

Acoustic mismatch model for thermal contact resistance of van der Waals contacts journal January 2009
Effects of chemical bonding on heat transport across interfaces journal April 2012
Atomic structure of tetrahedral amorphous carbon journal December 1993
Pressure tuning of the thermal conductance of weak interfaces journal November 2011
A Reexamination of Phonon Transport Through a Nanoscale Point Contact in Vacuum journal November 2013
Bonding and pressure-tunable interfacial thermal conductance journal November 2011
Role of Hydrogen Bonds in Thermal Transport across Hard/Soft Material Interfaces journal November 2016
Young's modulus, Poisson's ratio and failure properties of tetrahedral amorphous diamond-like carbon for MEMS devices journal February 2005
Measurement of the Length and Strength of Adhesive Interactions in a Nanoscale Silicon-Diamond Interface journal May 2015
Thermal conductivity of ultrathin tetrahedral amorphous carbon films journal July 2008
Adhesive contact based on the Lennard–Jones potential: a correction to the value of the equilibrium distance as used in the potential journal October 2004
Quantized thermal transport across contacts of rough surfaces journal October 2012
Adhesion of spheres: The JKR-DMT transition using a dugdale model journal April 1992

Cited By (3)

First-principles Modeling of Thermal Transport in Materials: Achievements, Opportunities, and Challenges journal December 2019
The frictional energy dissipation and interfacial heat conduction in the sliding interface journal November 2018
Comparison of thermal conductance of graphene/SiO 2 and graphene/Au interfaces based on Raman optothermal method journal September 2019

Figures / Tables (3)