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Analysis of TID Process Geometry and Bias Condition Dependence of 14-nm FinFETs and Implications for RF and SRAM Performance.

Conference ·

Abstract not provided.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1505290
Report Number(s):
SAND2016-6553C; 661824
Country of Publication:
United States
Language:
English

Cited By (7)

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FCC-ee: The Lepton Collider text January 2019
FCC-hh: The Hadron Collider text January 2019
FCC-ee: The Lepton Collider text January 2019
A novel body-on-insulator (BOI) FinFET with excellent TID tolerance and scaling capability journal September 2019
FCC-hh: The Hadron Collider: Future Circular Collider Conceptual Design Report Volume 3 journal July 2019
FCC-hh: The Hadron Collider text January 2019

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