Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Investigation of Single-Event Transients in AlGaN/GaN MIS-Gate HEMTs Using a Focused X-Ray Beam

Journal Article · · IEEE Transactions on Nuclear Science

Focused, pulsed X-rays are implemented to generate single-event transients (SETs) in metal-insulator-semiconductor (MIS)-gate AlGaN/GaN high-electron-mobility transistors (HEMTs) in order to examine the mechanisms responsible for SETs. Unlike Schottky-gate GaN HEMTs, where current flows between gate and drain when the device is biased "OFF," for the MIS-gate HEMTs, current flows between the source and drain. The presence of the SiNx insulating layer under the gate effectively blocks electrons on the gate from moving into the semiconductor. Short-duration SETs at the gate are caused by the collection of holes injected by the X-rays. SETs collected at the source and drain have an initial short-duration component, followed by a long-duration tail that can last for hundreds of nanoseconds. The long tails are due to positive charges (holes) that are less mobile than the electrons and so take longer to exit the HEMT, and to holes that become trapped at defects in the material. The holes lower the potential barrier between the source and the region under the gate, allowing for the injection of electrons that flow from the source to the drain. The durations of the SET tails are determined by the lifetimes of the trapped holes that are discovered to vary with X-ray photon energy and electrical bias.

Research Organization:
Argonne National Lab. (ANL), Lemont, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC)
Grant/Contract Number:
AC02-06CH11357
OSTI ID:
1504754
Journal Information:
IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 1 Vol. 66; ISSN 0018-9499
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

Similar Records

Growth of AlGaN/GaN heterojunction field effect transistors on semi-insulating GaN using an AlGaN interlayer
Journal Article · Mon Mar 16 00:00:00 EDT 2009 · Applied Physics Letters · OSTI ID:21176046

Investigation on High-κ Dielectric for Low Leakage AlGaN/GaN MIS-HEMT Device, Using Material Selection Methodologies
Journal Article · Sun Apr 15 00:00:00 EDT 2018 · Semiconductors · OSTI ID:22750010

Tri-gate GaN junction HEMT
Journal Article · Wed Oct 07 00:00:00 EDT 2020 · Applied Physics Letters · OSTI ID:1694377