Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Radiation induced nanovoid shrinkage in Cu at room temperature: An in situ study

Journal Article · · Scripta Materialia
 [1];  [1];  [1];  [1];  [2];  [1];  [1];  [1]
  1. Purdue Univ., West Lafayette, IN (United States)
  2. Argonne National Lab. (ANL), Argonne, IL (United States)
Radiation induced void swelling is widely observed in a variety of metallic materials. Here, by using sputtering deposition technique, we have introduced faceted nanovoids into Cu films. In-situ Kr ion irradiation was subsequently performed at room temperature to investigate the evolution of nanovoids. Most nanovoids found to shrink gradually with increasing dose. Irradiation induced high-density vacancy clusters exist mostly in the formof stacking fault tetrahedrons. Phase fieldmodeling reveales that void shrinkage arises from biased absorption of interstitials. These findings provide insights to the physical mechanisms of radiation response of nanovoids in metallic materials.
Research Organization:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Organization:
Office of Naval Research; USDOE Office of Nuclear Energy (NE)
Grant/Contract Number:
AC02-06CH11357
OSTI ID:
1503249
Journal Information:
Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: C Vol. 166; ISSN 1359-6462
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

Similar Records

Irradiation induced void spheroidization, shrinkage and migration in Cu at elevated temperatures: An in situ study
Journal Article · Tue Oct 06 20:00:00 EDT 2020 · Acta Materialia · OSTI ID:1864285

Recent Studies on Void Shrinkage in Metallic Materials Subjected to In Situ Heavy Ion Irradiations
Journal Article · Thu Sep 24 20:00:00 EDT 2020 · JOM. Journal of the Minerals, Metals & Materials Society · OSTI ID:1671392

In situ study on heavy ion irradiation induced microstructure evolution in single crystal Cu with nanovoids at elevated temperature
Journal Article · Thu Sep 08 20:00:00 EDT 2022 · Materials Today Communications · OSTI ID:1902961