Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

First look at the beam test results of the FPIX2 readout chip for the BTeV silicon pixel detector

Journal Article ·
High energy and nuclear physics experiments need tracking devices with excellent spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is a technology able to meet these challenges. We report the first results of the BTeV silicon pixel detector beam test carried out at Fermilab in summer 2004. Tests were performed using a 120 GeV/c proton beam incident on a 6 planes pixel detector telescope. The last prototype developed for the BTeV experiment (FPIX2) is tested in the middle of the telescope. There is no external trigger and events were built using the time-stamp information provided by the readout chips.
Research Organization:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-76CH03000
OSTI ID:
15017019
Report Number(s):
FERMILAB-PUB-04-338-CD
Country of Publication:
United States
Language:
English

Similar Records

Radiation tolerance of prototype BTeV pixel detector readout chips
Conference · Fri Jul 12 00:00:00 EDT 2002 · OSTI ID:796948

The architecture of the BTeV pixel readout chip
Conference · Mon Dec 02 23:00:00 EST 2002 · OSTI ID:805295

FPIX2, the BTeV pixel readout chip
Conference · Tue Dec 09 23:00:00 EST 2003 · OSTI ID:820023