Tomography of integrated circuit interconnect with an electromigration void.

Title: Tomography of integrated circuit interconnect with an electromigration void.

Journal Article · Mon May 01 00:00:00 EDT 2000 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.373095· OSTI ID:15002816

Levine, Z H; Kalukin, A R; Kuhn, M; Frigo, S P; McNulty, I; Retsch, C C; Wang, Y; Arp, U; Lucatorto, T B; Ravel, B D; Tarrio, C; XFD,

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Research Organization:: Advanced Photon Source, Argonne National Lab., IL (US); NIST; Intel Corp. (US)

Journal Information:: Journal of Applied Physics, Vol. 87, Issue 9, pt.1; Other Information: PBD: 1 May 2000; Related Information: May 1, 2000

Tomography of integrated circuit interconnect with an electromigration void

Journal Article · Mon May 01 00:00:00 EDT 2000 · Journal of Applied Physics · OSTI ID:15002816

Levine, Zachary H; Kalukin, Andrew R; Kuhn, Markus; +7 more

Journal Article · Thu Jan 01 00:00:00 EST 2004 · J. Appl. Phys. · OSTI ID:15002816

Levine, Z H; Grantham, S; Paterson, D; +5 more

Tomographic reconstruction of an integrated circuit interconnect.

Journal Article · Mon Jan 04 00:00:00 EST 1999 · Applied Physics Letters · OSTI ID:15002816

Levine, Z H; Kalukin, A R; Frigo, S P; +3 more

42 ENGINEERING
CONNECTORS
ELECTROPHORESIS
INTEGRATED CIRCUITS
TOMOGRAPHY
ADVANCED PHOTON SOURCE