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Hyperconnected molecular glass network architectures with exceptional elastic properties

Journal Article · · Nature Communications
 [1];  [2];  [3];  [3];  [3];  [4];  [2]
  1. Stanford Univ., Stanford, CA (United States); Stanford University
  2. Stanford Univ., Stanford, CA (United States)
  3. IBM Almaden Research Center, San Jose, CA (United States)
  4. Stanford Univ., Stanford, CA (United States); IBM Almaden Research Center, San Jose, CA (United States)

Hyperconnected network architectures can endow nanomaterials with remarkable mechanical properties that are fundamentally controlled by designing connectivity into the intrinsic molecular structure. For hybrid organic–inorganic nanomaterials, here we show that by using 1,3,5 silyl benzene precursors, the connectivity of a silicon atom within the network extends beyond its chemical coordination number, resulting in a hyperconnected network with exceptional elastic stiffness, higher than that of fully dense silica. The exceptional intrinsic stiffness of these hyperconnected glass networks is demonstrated with molecular dynamics models and these model predictions are calibrated through the synthesis and characterization of an intrinsically porous hybrid glass processed from 1,3,5(triethoxysilyl) benzene. Altogether, the proposed molecular design strategy applies to any materials system wherein the mechanical properties are controlled by the underlying network connectivity.

Research Organization:
Stanford Univ., Stanford, CA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
Grant/Contract Number:
FG02-07ER46391
OSTI ID:
1499684
Journal Information:
Nature Communications, Journal Name: Nature Communications Journal Issue: 1 Vol. 8; ISSN 2041-1723
Publisher:
Nature Publishing GroupCopyright Statement
Country of Publication:
United States
Language:
English

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Cited By (4)

Design of Ultrastiff Organosilicate Hybrid Glasses journal August 2019
Optically Transparent Protective Coating for Plastics Using Dual Spray and Atmospheric Plasma Deposition journal February 2018
Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects journal June 2019
Theoretical search for heterogeneously architected 2D structures journal July 2018

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