Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

SPICE Circuit Modeling to Locate Failures on a Printed Circuit Board.

Conference ·
OSTI ID:1494414
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1494414
Report Number(s):
SAND2014-16112D; 533066
Country of Publication:
United States
Language:
English

Similar Records

Printed Circuit Board Design.
Conference · Wed Jun 01 00:00:00 EDT 2016 · OSTI ID:1367581

Predicting Fatigue Failure of a Circuit Board in Random Vibration:The Reference Model.
Conference · Tue Oct 01 00:00:00 EDT 2013 · OSTI ID:1117158

Predicting Fatigue Failure of a Circuit Board in Random Vibration: The Reference Model.
Conference · Fri Feb 28 23:00:00 EST 2014 · OSTI ID:1141112

Related Subjects