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Progress and Perspective: Soft Thermoelectric Materials for Wearable and Internet‐of‐Things Applications

Journal Article · · Advanced Electronic Materials
 [1];  [2];  [3];  [4]
  1. Department of Chemical Engineering University of California Berkeley CA 94720 USA, The Molecular Foundry Lawrence Berkeley National Laboratory Berkeley CA 94720 USA
  2. The Molecular Foundry Lawrence Berkeley National Laboratory Berkeley CA 94720 USA, Applied Science and Technology Graduate Group University of California Berkeley CA 94720 USA
  3. The Molecular Foundry Lawrence Berkeley National Laboratory Berkeley CA 94720 USA, Department of Mechanical Engineering University of California Berkeley CA 94720 USA, School of Engineering University of California Merced CA 95343 USA
  4. The Molecular Foundry Lawrence Berkeley National Laboratory Berkeley CA 94720 USA

Abstract

Soft thermoelectric materials, including conjugated polymers and organic–inorganic hybrids, now demonstrate figures of merit approaching those of inorganic materials. These materials development breakthroughs enable the design of thermoelectric devices that exhibit appropriate efficiencies for commercial use, while simultaneously leveraging the unique processing and mechanical advantages of soft materials. Such a technology opens the door to a suite of new thermoelectric applications, including power generation for biomedical implants and the Internet of Things, or wearable heating and cooling devices. In order to realize deployment of such technologies, there is a fundamental need for deeper understanding of the complex transport physics underlying thermoelectric transport in soft materials. Here, the current state of the art in soft thermoelectrics materials is discussed, and outstanding challenges specific to organic and organic–inorganic hybrid systems are highlighted.

Sponsoring Organization:
USDOE
Grant/Contract Number:
AC02-05CH11231
OSTI ID:
1493566
Journal Information:
Advanced Electronic Materials, Journal Name: Advanced Electronic Materials Journal Issue: 11 Vol. 5; ISSN 2199-160X
Publisher:
Wiley Blackwell (John Wiley & Sons)Copyright Statement
Country of Publication:
United States
Language:
English

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