Impact of Heat Dissipation Profiles on Power Electronics Packaging Design
- Univ. of Tennessee, Knoxville, TN (United States)
- Univ. of Tennessee, Knoxville, TN (United States); Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
This work focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. Finally, a more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm optimization is also proposed for a more accurate thermal design.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-00OR22725
- OSTI ID:
- 1474615
- Journal Information:
- IEEE Transportation Electrification Conference and Expo, Conference: IEEE Transportation Electrification Conference & Expo (ITEC 2018), Long Beach, CA (United States), 13-15 Jun 2018; ISSN 2377-5483
- Publisher:
- IEEE
- Country of Publication:
- United States
- Language:
- English
Similar Records
SiC Power Electronics in Medium Voltage Motor Drives: Trade and Manufacturing Analysis
A Manufacturing Cost and Supply Chain Analysis of SiC Power Electronics Applicable to Medium-Voltage Motor Drives