Report on technical activities and technical plan for university advanced manufacturing work for in-pile sensors
- Idaho National Lab. (INL), Idaho Falls, ID (United States)
This report details the technical plan for work package 4 of the In-Pile sensor program. It covers technical plans for INL and university (Boise State University and University of Notre Dame) for advanced manufacturing of sensors for in-pile measurements.
- Research Organization:
- Idaho National Lab. (INL), Idaho Falls, ID (United States)
- Sponsoring Organization:
- USDOE Office of Nuclear Energy (NE)
- DOE Contract Number:
- AC07-05ID14517
- OSTI ID:
- 1473593
- Report Number(s):
- INL/EXT-17-43410-Rev000
- Country of Publication:
- United States
- Language:
- English
Similar Records
Laser-based Adhesion Strength Measurements for Advanced Manufactured Sensor Adhesion Characterization
Out-of-Pile Testing of Radiation Hard Optical Fibers
Initial Temperature Testing of Advanced Manufactured Melt Wire Package
Technical Report
·
Thu Jul 01 00:00:00 EDT 2021
·
OSTI ID:1473593
Out-of-Pile Testing of Radiation Hard Optical Fibers
Technical Report
·
Mon Jul 01 00:00:00 EDT 2019
·
OSTI ID:1473593
+3 more
Initial Temperature Testing of Advanced Manufactured Melt Wire Package
Technical Report
·
Sun Mar 01 00:00:00 EST 2020
·
OSTI ID:1473593
+3 more