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Title: Si:SrTiO3-Al2O3-Si:SrTiO3 multi-dielectric architecture for metal-insulator-metal capacitor applications

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4968185· OSTI ID:1465949
ORCiD logo [1]; ORCiD logo [1]; ORCiD logo [2];  [1]
  1. Univ. of Puerto Rico, San Juan, PR (United States). Department of Physics and Institute for Functional Nanomaterials
  2. Univ. of Puerto Rico, San Juan, PR (United States). Department of Physics and Institute for Functional Nanomaterials; Univ. of St. Andrews, Scotland (United Kingdom). School of Chemistry and Physics

We present that metal-insulator-metal (MIM) capacitors comprised of amorphous Si:SrTiO3-Al2O3-Si:SrTiO3 multi-dielectric architecture have been fabricated employing a combination of pulsed laser and atomic layer deposition techniques. The voltage linearity, temperature coefficients of capacitance, dielectric and electrical properties upon thickness were studied under a wide range of temperature (200–400 K) and electric field stress (61.5 MV/cm). A high capacitance density of 31 fF/μm2, a low voltage coefficient of capacitance of 363 ppm/V2, a low temperature coefficient of capacitance of <644 ppm/K, and an effective dielectric constant of 133 are demonstrated in a MIM capacitor with 1.4 nm capacitance equivalent thickness in a 40 nm thick ultra high-k multi-dielectric stack. Finally, all of these properties make this dielectric architecture of interest for next generation, highly scaled MIM capacitor applications.

Research Organization:
Univ. of Puerto Rico, San Juan, PR (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
FG02-08ER46526
OSTI ID:
1465949
Alternate ID(s):
OSTI ID: 1333015
Journal Information:
Applied Physics Letters, Vol. 109, Issue 21; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 6 works
Citation information provided by
Web of Science

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