Si:SrTiO3-Al2O3-Si:SrTiO3 multi-dielectric architecture for metal-insulator-metal capacitor applications
- Univ. of Puerto Rico, San Juan, PR (United States). Department of Physics and Institute for Functional Nanomaterials
- Univ. of Puerto Rico, San Juan, PR (United States). Department of Physics and Institute for Functional Nanomaterials; Univ. of St. Andrews, Scotland (United Kingdom). School of Chemistry and Physics
We present that metal-insulator-metal (MIM) capacitors comprised of amorphous Si:SrTiO3-Al2O3-Si:SrTiO3 multi-dielectric architecture have been fabricated employing a combination of pulsed laser and atomic layer deposition techniques. The voltage linearity, temperature coefficients of capacitance, dielectric and electrical properties upon thickness were studied under a wide range of temperature (200–400 K) and electric field stress (61.5 MV/cm). A high capacitance density of 31 fF/μm2, a low voltage coefficient of capacitance of 363 ppm/V2, a low temperature coefficient of capacitance of <644 ppm/K, and an effective dielectric constant of 133 are demonstrated in a MIM capacitor with 1.4 nm capacitance equivalent thickness in a 40 nm thick ultra high-k multi-dielectric stack. Finally, all of these properties make this dielectric architecture of interest for next generation, highly scaled MIM capacitor applications.
- Research Organization:
- Univ. of Puerto Rico, San Juan, PR (United States)
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- FG02-08ER46526
- OSTI ID:
- 1465949
- Alternate ID(s):
- OSTI ID: 1333015
- Journal Information:
- Applied Physics Letters, Vol. 109, Issue 21; ISSN 0003-6951
- Publisher:
- American Institute of Physics (AIP)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
Web of Science
Recent advances in the understanding of high- k dielectric materials deposited by atomic layer deposition for dynamic random-access memory capacitor applications
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journal | November 2019 |
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