Do voids nucleate at grain boundaries during ductile rupture? [Do voids initiate at grain boundaries during ductile rupture?]
Journal Article
·
· Acta Materialia
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
In the absence of pre-existing failure-critical defects, the fracture or tearing process in deformable metals loaded in tension begins with the nucleation of internal cavities or voids in regions of elevated triaxial stress. While ductile rupture processes initiate at inclusions or precipitates in many alloys, nucleation in pure metals is often assumed to be associated with grain boundaries or triple junctions. This study presents ex situ observations of incipient, subsurface void nucleation in pure tantalum during interrupted uniaxial tensile tests using electron channeling contrast (ECC) imaging, electron backscatter diffraction (EBSD), transmission Kikuchi diffraction (TKD) and transmission electron microscopy (TEM). Instead of forming at grain boundaries, voids initiated at and grew along dislocation cell and cell block boundaries created by plastic deformation. Most of the voids were associated with extended, lamellar deformation-induced boundaries that run along the traces of the {110} or {112} planes, though a few voids initiated at low-angle dislocation subgrain boundaries. In general, a high density of deformation-induced boundaries was observed near the voids. TEM and TKD demonstrate that voids initiate at and grow along cell block boundaries. Two mechanisms for void nucleation in pure metals, vacancy condensation and stored energy dissipation, are discussed in light of these results. In conclusion, the observations of the present investigation suggest that voids in pure materials nucleate by vacancy condensation and subsequently grow by consuming dislocations.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1465810
- Report Number(s):
- SAND--2017-4790J; 666530
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: C Vol. 137; ISSN 1359-6454
- Publisher:
- ElsevierCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Effects of Dynamic Strain Aging on Strain Hardening Behavior, Dislocation Substructure, and Fracture Morphology in a Ferritic Stainless Steel
|
journal | December 2019 |
Void growth by dislocation adsorption
|
journal | December 2019 |
The Effect of Elastic Strain and Small Plastic Deformation on Tensile Strength of a Lean Al–Mg–Si Alloy
|
journal | November 2019 |
Void growth by dislocation adsorption
|
text | January 2019 |
Void growth by dislocation adsorption
|
text | January 2019 |
Similar Records
Nanoscale conditions for ductile void nucleation in copper: vacancy condensation and the growth-limited microstructural state
Role of Vacancies and Solute Atoms on Grain Boundary Sliding
Role of vacancies and solute atoms on grain boundary sliding
Journal Article
·
Thu Nov 14 19:00:00 EST 2019
· Acta Materialia
·
OSTI ID:1574704
Role of Vacancies and Solute Atoms on Grain Boundary Sliding
Conference
·
Sun Oct 29 23:00:00 EST 2000
·
OSTI ID:15007437
Role of vacancies and solute atoms on grain boundary sliding
Conference
·
Sat Jul 01 00:00:00 EDT 2000
·
OSTI ID:20104672