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Elucidating the contribution of mobile hydrogen-deformation interactions to hydrogen-induced intergranular cracking in polycrystalline nickel

Journal Article · · Acta Materialia
 [1];  [2];  [3];  [4];  [1];  [5]
  1. Univ. of Virginia, Charlottesville, VA (United States)
  2. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
  3. Sandia National Lab. (SNL-CA), Livermore, CA (United States)
  4. OxMet Technologies, Oxford (United Kingdom)
  5. Southwest Research Institute, San Antonio, TX (United States); Kyushu Univ., Fukuoka (Japan)
Uniaxial mechanical testing conducted at room temperature (RT) and 77 K on hydrogen (H)-exposed nickel was coupled with targeted microscopy to evaluate the influence of deformation temperature, and therefore mobile H-deformation interactions, on intergranular cracking in nickel. Results from interrupted tensile tests conducted at cryogenic temperatures (77 K), where mobile H-deformation interactions are effectively precluded, and RT, where mobile H-deformation interactions are active, indicate that mobile H-deformation interactions are not an intrinsic requirement for H-induced intergranular fracture. Moreover, an evaluation of the true strain for intergranular microcrack initiation for testing conducted at RT and 77 K suggests that H which is segregated to grain boundaries prior to the onset of straining dominates the H-induced fracture process for the prescribed H concentration of 4000 appm. Lastly, recent experiments suggesting that H-induced fracture is predominately driven by mobile H-deformation interactions, as well as the increased susceptibility of coherent twin boundaries to H-induced crack initiation, are re-examined in light of these new results.
Research Organization:
Sandia National Laboratories (SNL-CA), Livermore, CA (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC02-05CH11231; AC04-94AL85000
OSTI ID:
1465388
Alternate ID(s):
OSTI ID: 1703711
Report Number(s):
SAND--2018-8650J; 666958
Journal Information:
Acta Materialia, Journal Name: Acta Materialia Journal Issue: C Vol. 158; ISSN 1359-6454
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

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