Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Comenencia Ortiz, Lizmarie; Heinz, David B.; Flader, Ian B.; Alter, Anne L.; Shin, Dongsuk D.; Chen, Yunhan; Kenny, Thomas W.

doi:10.1557/mrc.2018.70

Title: Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Journal Article · Thu Apr 12 00:00:00 EDT 2018 · MRS Communications

DOI:https://doi.org/10.1557/mrc.2018.70· OSTI ID:1461954

^[1]; Heinz, David B. ^[1]; Flader, Ian B. ^[1]; Alter, Anne L. ^[1]; Shin, Dongsuk D. ^[1]; Chen, Yunhan ^[1]; Kenny, Thomas W. ^[1]

Stanford Univ., CA (United States). Dept. of Mechanical Engineering

Millions of micro electro mechanical system sensors are fabricated each year using an ultra-clean process that allows for a vacuum-encapsulated cavity. These devices have a multi-layer structure that contains hidden layers with highly doped silicon, which makes common imaging techniques ineffective. Thus, examining device features post-fabrication, and testing, is a significant challenge. Here in this paper, we use a combination of micro- and nano-scale x-ray computed tomography to study device features and assess failure mechanisms in such devices without destroying the ultra-clean cavity. This provides a unique opportunity to examine surfaces and trace failure mechanisms to specific steps in the fabrication process.

View Accepted Manuscript (DOE)

Cite

Export

Save

Research Organization:: SLAC National Accelerator Lab., Menlo Park, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES); Defense Advanced Research Projects Agency (DARPA)

Grant/Contract Number:: AC02-76SF00515; N66001-12-1-4260; ECS-9731293

OSTI ID:: 1461954

Journal Information:: MRS Communications, Vol. 8, Issue 02; ISSN 2159-6859

Publisher:: Materials Research Society - Cambridge University PressCopyright Statement

Country of Publication:: United States

Language:: English

Citation Metrics:

Cited by: 2 works

Citation information provided by
Web of Science

References (14)

High-resolution X-ray imaging—a powerful nondestructive technique for applications in semiconductor industry Zschech, Ehrenfried; Yun, Wenbing; Schneider, Gerd Applied Physics A, Vol. 92, Issue 3 https://doi.org/10.1007/s00339-008-4551-x	journal	May 2008
Critical Review: Adhesion in surface micromechanical structures Maboudian, Roya Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 15, Issue 1 https://doi.org/10.1116/1.589247	journal	January 1997
On the stiction of MEMS materials Zhuang, Y. X.; Menon, A. Tribology Letters, Vol. 19, Issue 2 https://doi.org/10.1007/s11249-005-5088-1	journal	June 2005
Experimental Investigation Into Stiction Forces and Dynamic Mechanical Anti-Stiction Solutions in Ultra-Clean Encapsulated MEMS Devices Heinz, David B.; Hong, Vu A.; Ahn, Chae Hyuck Journal of Microelectromechanical Systems, Vol. 25, Issue 3 https://doi.org/10.1109/JMEMS.2016.2525008	journal	June 2016
High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications de Veen, P. J.; Bos, C.; Hoogstede, D. R. Microelectronics Reliability, Vol. 55, Issue 9-10 https://doi.org/10.1016/j.microrel.2015.06.065	journal	August 2015
Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators Kim, Bongsang; Candler, Rob N.; Hopcroft, Matthew A. Sensors and Actuators A: Physical, Vol. 136, Issue 1 https://doi.org/10.1016/j.sna.2006.10.040	journal	May 2007
TXM-Wizard : a program for advanced data collection and evaluation in full-field transmission X-ray microscopy Liu, Yijin; Meirer, Florian; Williams, Phillip A. Journal of Synchrotron Radiation, Vol. 19, Issue 2 https://doi.org/10.1107/S0909049511049144	journal	January 2012
A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading Muhlstein, C. L.; Stach, E. A.; Ritchie, R. O. Acta Materialia, Vol. 50, Issue 14 https://doi.org/10.1016/S1359-6454(02)00158-1	journal	August 2002
X-Ray Interactions: Photoabsorption, Scattering, Transmission, and Reflection at E = 50-30,000 eV, Z = 1-92 Henke, B. L.; Gullikson, E. M.; Davis, J. C. Atomic Data and Nuclear Data Tables, Vol. 54, Issue 2, p. 181-342 https://doi.org/10.1006/adnd.1993.1013	journal	July 1993
Fatigue Experiments on Single Crystal Silicon in an Oxygen-Free Environment Hong, Vu A.; Yoneoka, Shingo; Messana, Matthew W. Journal of Microelectromechanical Systems, Vol. 24, Issue 2 https://doi.org/10.1109/JMEMS.2014.2331231	journal	April 2015
X-ray metrology for advanced microelectronics Wyon, C. The European Physical Journal Applied Physics, Vol. 49, Issue 2 https://doi.org/10.1051/epjap/2009211	journal	January 2010
Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators Candler, Rob N.; Hopcroft, Matthew A.; Kim, Bongsang Journal of Microelectromechanical Systems, Vol. 15, Issue 6 https://doi.org/10.1109/JMEMS.2006.883586	journal	January 2006
A Unified Epi-Seal Process for Fabrication of High-Stability Microelectromechanical Devices Yang, Yushi; Ng, Eldwin J.; Chen, Yunhan Journal of Microelectromechanical Systems, Vol. 25, Issue 3 https://doi.org/10.1109/JMEMS.2016.2537829	journal	June 2016
Robust Method of Fabricating Epitaxially Encapsulated MEMS Devices with Large Gaps Chen, Yunhan; Flader, Ian B.; Shin, Dongsuk D. Journal of Microelectromechanical Systems, Vol. 26, Issue 6 https://doi.org/10.1109/JMEMS.2017.2758388	journal	December 2017