Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder

Gong, Wei; Li, Pengfei; Zhang, Yunheng; Feng, Xuhui; Major, Joshua; DeVoto, Douglas; Paret, Paul; King, Charles; Narumanchi, Sreekant; Shen, Sheng

doi:10.1021/acs.nanolett.8b00692

Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder

Journal Article · Wed May 16 00:00:00 EDT 2018 · Nano Letters

DOI:https://doi.org/10.1021/acs.nanolett.8b00692· OSTI ID:1456864

Gong, Wei ^[1]; Li, Pengfei ^[1]; Zhang, Yunheng ^[1]; Feng, Xuhui ^[2]; Major, Joshua ^[2]; DeVoto, Douglas ^[2]; Paret, Paul ^[2]; King, Charles ^[2]; Narumanchi, Sreekant ^[2]; ^[1]

Carnegie Mellon Univ., Pittsburgh, PA (United States)
National Renewable Energy Lab. (NREL), Golden, CO (United States)

Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term 'supersolder' to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional solders and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.

View Accepted Manuscript (DOE)

Research Organization:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Organization:: U.S. Department of Defense (DOD), Defense Advanced Research Projects Agency (DARPA); USDOE

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1456864

Report Number(s):: NREL/JA--5400-71577

Journal Information:: Nano Letters, Journal Name: Nano Letters Journal Issue: 6 Vol. 18; ISSN 1530-6984

Publisher:: American Chemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder

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