Reduction of Resistivity in Cu Thin Films by Partial Oxidation: Microstructural Mechanisms
Program Document
·
OSTI ID:1441657
- Research Organization:
- SLAC National Accelerator Laboratory (SLAC), Menlo Park, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- AC02-76SF00515
- OSTI ID:
- 1441657
- Report Number(s):
- SLAC-PUB-10201
- Country of Publication:
- United States
- Language:
- English
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