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Title: Microstructural evolution and deformation behavior of Al-Cu alloys: A Transmission X-ray Microscopy (TXM) and micropillar compression study

Journal Article · · Acta Materialia

In this paper, a unique approach to correlating an evolving 3D microstructure in an Al-Cu alloy and its micro-scale mechanical properties has been introduced. Using these nanoscale three-dimensional microstructures derived from Transmission X-ray Microscopy (TXM), individual contributions from different strengthening mechanisms were quantified. The spatial distribution and morphology of the individual θ' and θ phases were seen to play an important role in influencing dislocation storage. Uniaxial micro-compression experiments were used to quantify the stress-strain response of the alloy at different aging times. Transmission electron microscopy (TEM) aided in discerning dislocation activity at these precipitates. A model is proposed to accurately predict the variation in yield stress by using appropriate morphological parameters from the 3D microstructure and its validity has been corroborated using experimental measurements. Distributions of 2D and 3D inter-precipitate spacing were seen to provide crucial insights on influencing deformation in such precipitation-strengthened alloys. In conclusion, the transition in deformation behavior and origin of numerous strain bursts were investigated using in situ micropillar compression testing.

Research Organization:
Argonne National Lab. (ANL), Argonne, IL (United States); Arizona State Univ., Tempe, AZ (United States)
Sponsoring Organization:
USDOE Office of Science (SC); US Army Research Office (ARO)
Grant/Contract Number:
AC02-06CH11357; W911NF1410550
OSTI ID:
1437370
Alternate ID(s):
OSTI ID: 1549107
Journal Information:
Acta Materialia, Vol. 144; ISSN 1359-6454
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 26 works
Citation information provided by
Web of Science

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