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A new method for interlaminar stress analysis in symmetric laminates containing a circular hole

Conference ·
OSTI ID:143204
;  [1]
  1. National Chung-Hsing Univ., Taichung (Taiwan, Province of China). Institute of Applied Mathematics

A simple and efficient technique of qualitative analysis for determining the interlaminar stress ratios around a circular hole in symmetric laminates under far-field inplane loads is presented. Based on the authors recently developed method for calculating the interlaminar stress distributions around a circular hole in symmetric laminates, two equations relating the interlaminar stresses to inplane stresses are established. In addition, two inplane stress parameters {tau} and {sigma} which are calculated by Lekhnitskii`s two-dimensional anisotropic solutions in conjunction with the classical lamination plate theory are proposed to determine the interlaminar stress ratios at the interfaces of a laminate. Numerical examples are compared with existing solutions in literature to show that the present method would greatly help the designers to consider the delamination effect of notched laminates.

OSTI ID:
143204
Report Number(s):
CONF-930246--; ISBN 0-87339-251-5
Country of Publication:
United States
Language:
English